Epoxy feed mechanism of full -automatic plastic packaging machine of semiconductor

半导体全自动塑封机的环氧树脂上料机构

Abstract

The utility model discloses an epoxy feed mechanism of full -automatic plastic packaging machine of semiconductor, including work platform, vibration dish, wired hose, epoxy decollator, X axle move actuating cylinder, the tool of feeding, Y through -drive servo motor, Z axle alternating current motor and drive chain, epoxy decollator, tool straggly the placing on work platform about side by side of feeding, wired hose terminal with epoxy decollator intercommunication, the X axle moves the actuating cylinder drive the epoxy decollator drives the tool of feeding and releases in the epaxial removal of Z and the epoxy on the tool of feeding and accomplish the material loading at the epaxial removal of Y, the external pushing equipment of Z axle alternating current motor and drive chain common drive at the epaxial removal of X, Y through -drive servo motor, realizing automatic feeding through automatic mechanism, need not manual operation, the material loading is efficient, has saved the cost of labor, and the mechanism is very simple compact, operates more simple and conveniently, and not fragile life cycle is long, and the manufacturing cost of mechanism is also lower.
本实用新型公开了一种半导体全自动塑封机的环氧树脂上料机构,包括工作平台、振动盘、钢丝软管、环氧树脂分割器、X轴移动气缸、装料治具、Y轴传动伺服电机、Z轴交流马达和传动链条,环氧树脂分割器、装料治具并排上下错落放置在工作平台上,钢丝软管末端与环氧树脂分割器连通,X轴移动气缸驱动所述环氧树脂分割器在X轴上移动,Y轴传动伺服电机驱动装料治具在Y轴上移动,Z轴交流马达和传动链条共同驱动外置推料机构在Z轴上移动并把装料治具上的环氧树脂推出完成上料;通过自动化的机构实现自动上料,无需人工操作,上料效率高,节省了人工成本,机构非常简单紧凑,操作更加简单方便,不易损坏使用周期长,机构制造成本也更低。

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